ASUS Launches the GeForce GTX670 DirectCU Mini Graphics Card

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ASUS_za
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ASUS Launches the GeForce GTX670 DirectCU Mini Graphics Card

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Taipei, Taiwan (2 April, 2013) — ASUS today announced the GeForce® GTX 670 DirectCU Mini, a compact high-performance graphics card designed primarily for small form factor PCs with mini ITX motherboards. The dual-slot card measures just 17cm and features the NVIDIA® GTX 670 GPU for DirectX® 11.1-compatible gaming. The reference GTX 670 measures 24.13cm, for comparison.
Small form factor PCs based on mini ITX motherboards are a popular choice for gamers and home users. Their compact cases are much easier to transport to LAN parties than a standard desktop PC, and stylish designs with comparatively low power requirements make them a natural choice for home theater PCs. The ASUS GeForce® GTX 670 DirectCU Mini is designed to maximize the potential offered by mini ITX motherboards by delivering high performance graphics. It uses an exclusive DirectCU thermal design that combines a heat-spreading vapor chamber and the CoolTech Fan, which provides wide-angle airflow and venting to cool critical graphics card components.

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New DirectCU Mini with vapor chamber and CoolTech Fan
ASUS has re-engineered the DirectCU cooler to fit small form factor cases. While shorter, it introduces a copper vapor chamber placed directly on top of the GPU for faster heat spreading and dispersal with 20% (or 7.5∘C) lower temperatures than reference GTX 670. Also new is the CoolTech Fan, a blower/axial crossover. Its inclusion translates into wide-angle and powerful airflow that keeps vital card components cool, with heat vented through the back and top of the card. It also provides three times quieter operation, all within a limited space.

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Direct Power and Super Alloy Power for stable and durable performance
Taking advantage of its smaller form factor, the ASUS GeForce® GTX 670 DirectCU Mini uses Direct Power technology, which bridges power delivery components and the GPU for clean and efficient power supply, delivering 56% lower impedance and a 15% cooler PCB. Super Alloy Power capacitors, chokes, and MOSFETs are hardened against heat and stress, averaging 2.5 times the lifespan of generic parts.

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