[Press Release] ASUS ROG Creates and Launches Patent-Pending

[ASUS_za]

Taipei, Taiwan (July 23, 2012) ― making its first appearance on the ASUS ROG Maximus V Formula gaming and overclocking motherboard, Fusion Thermo™ combines enhanced passive air heat dissipation with liquid cooling readiness. It represents another ROG exclusive, and the first such design on any commercially-available motherboard. ASUS has applied for a Fusion Thermo™ patent, and the feature has garnered official endorsement from ten of the most renowned makers of liquid cooling hardware, including Swiftech® and EKWB. Fusion Thermo™ offers customers the utmost thermal flexibility and efficiency for intense gaming, overclocking, and case modding.

For the full Press Release, please see this link:

https://dl.dropbox.com/u/12287926/ROG%2 ... Design.doc